COB, Chip On Board packaging technology, is to adhere the bare chip with conductive or non-conductive glue on the interconnect substrate; COG, Chip On Glass technology, the driver chip is directly bonded to the glass, with a transparent feature.
COB features: COB technology has the following advantages: low price; space saving; mature technology. COB technology also has shortcomings, that is, it needs to be equipped with another welding machine and packaging machine, sometimes the speed can’t keep up; PCB patch has stricter requirements on the environment; it can’t be repaired.
1. Process simplification. Directly attaching IC to the conductive electrode of the LCD panel, reducing the soldering process;
2. The volume ratio is greatly reduced, making it easier to miniaturize, simplify, and highly integrated.
3, there is no problem such as IC deformation
4. Because the chip is pressed onto the glass, the cost is relatively high.